Bringing sexy back to US heterogeneous integration manufacturing
Talk#1: Chiplet technology landscape in the USA by Dr Jawad Nasrullah. Chiplets are smaller, easier-to-manufacture components that make it faster and cheaper to create complex integrated circuits. With chiplets, designers can now divide the chip into smaller pieces and later combine them in a package with high-speed interfaces. This approach reduces the likelihood of defects and allows for more flexibility in integrating chiplets of different sizes, technologies, and origins. However, this process requires new design tools, methodologies, and manufacturing processes, as well as new standards and marketplaces for sourcing chiplets from third-party providers. While more advanced IC processes and fabs are being developed, heterogeneous integration through chiplets could be a profitable way to quickly produce advanced US-made products at scale.
The US Chips Act provides incentives for developing chiplet technology and advanced packaging in the US, and several industry alliances have been formed to tackle this challenge. While there is still a need to develop a viable high-volume business case for US-based IC manufacturing, the allocation of Chips Act funds to many competing initiatives is impeding progress toward that goal. Organizations such as OCP/ODSA are working to seed a commercial chiplet economy by developing an open chiplet ecosystem that promotes cross-pollination and standardization across the industry. This includes introducing chiplet interconnect standards, chiplet business workflow tools, chiplet technical workflow standardizations, and chiplet modeling standards. This talk will cover the need for US-based System in Package (SiP) manufacturing and pilot line assembly facilities that designers can access without bureaucracy and key issues that need to be addressed such as die-partitioning, chiplet availability, and overhead costs. A new alliance of local businesses, Chiplet.us, is being introduced for a chiplet-based design and manufacturing collaborative ecosystem. Let's bring sexy back to hardware engineering in the US!
Talk#2: Advanced packaging landscape in the USA by Richard (Dick) F. Otte.
The second section addresses the detailed technical issues related to the assembly of chiplets. The emphasis is on the part and substrate configuration details, substrate capabilities and options, and the resulting assembly processes, joining methods, tool sets, test issues, and overall coordination to complete the assembly process. These elements are summarized from the USA perspective that highlights the US capabilities, pilot line needs, and directions.
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