Not Just Chips: Novel Techniques for IC Integration and Packaging Using Additive Technologies
Novel Techniques for IC Integration and Packaging Using Additive Technologies
Patricia Beck
NextFlex
Flexible Hybrid Electronics (FHE) combines a variety of processes coming from industries such as conventional electronics manufacturing, printing, plastics processing, additive manufacturing, laser imaging and robotic assembly. It combines thinned dies, printed components, flexible, conformal materials for electronics enabling new shapes and form factors. NextFlex as a consortium and a manufacturing hub unites a broad community of technology providers, end users and a unique combination of manufacturing tools that together make FHE possible. Additive processes enable us to erase the boundaries between advanced packaging and circuit boards. It also becomes possible to integrate wiring and antennae on and in structures such as aircraft or automotive panels. The combination of processes opens up an exciting level of technology convergence, leading to electronics being integrated at a system level. This talk provides an overview of projects at NextFlex and its members/partners that facilitate US manufacturing innovation for electronics packaging and integration. Among the topics presented will be work on flip chip attachment of thinned bare die microcontrollers on non-traditional substrates and conductors, integration of unpackaged MEMs devices, and use of additive techniques to replace wire bonds for direct IC integration on PCB.
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