Heat transfer simulation of heat source with fins using Comsol

Published: 18 October 2021
on channel: Jaf-Science
17,862
231

This tutorial shows a 3D heat transfer model of a computer chip (heat source) cooled by fins (heat sink). A stationary study with parametric sweep is used to check the effect of increasing fin length on the maximum temperature of the chip.

00:00 Intro
00:20 Geometry
04:41 Materials
06:35 Physics
11:05 Mesh
11:50 Solution
14:15 Results

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