Integrating Microelectronics into Classrooms: Thermo-Calc Online for the Design of Solder Materials
2022.05.11 Congying Wang, Purdue University
The Thermo-Calc Online Tool can be found at https://nanohub.org/tools/tcacademic
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In microelectronics, components are attached to circuit boards with a material that can carry the electrical signals through and form a strong mechanical bond, known as solder. The mechanical properties and joint reliability of solders strongly depend on the physical metallurgy and microstructure. Understanding the behavior of existing solders and developing new ones requires a complete understanding of the system such as solidification, aging, and intermetallic formation.
Phase diagrams are widely used in the electronics industry to determine the presence of intermetallic compounds, the melting point of alloys, and the solubility of elements at different temperatures. Thermo-Calc is an ideal computational tool to obtain such understandings for various solders.
This presentation will first present how industrial soldering practices can be contextualized into current engineering classrooms, especially in materials science, to provide students with situated learning experiences. Then we will demonstrate how Thermo-Calc can be utilized as an effective self-learning or teaching tool to solve real-world engineering problems relevant to solders.
Table of Contents:
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