Enabling 56 Gbps Solutions in Printed Circuit Board Technology by Terence Regan from Amphenol
Straight from Dgcon 2017 - The Main Signal & Power Integrity Event In Israel!
http://www.dgcon.info/
Initiated by Dgtronix, Dgcon is the first Israeli conference targeted to provide the necessary technical knowledge, covering many aspects of Hardware Design.
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The Lecture:
Next Generation system designs require solutions that support 56Gbps and beyond. In regards to printed circuit boards, new design attributes and better controls on already challenging attributes are required to allow systems to function at these data rates. In the work done by Amphenol, processes have been developed to support these attributes such as back drill stub lengths, impedance control, copper roughness in order to support long channels reaching 56 Gbps. The work shared in the presentation will focus on new copper foils, bond treatment including APC’s proprietary UltraSpeedTM processing which provides the industry’s lowest insertion loss solution on the market today. Also included in this work are the effects of back drill stub lengths on signal integrity and registration effects on impedance.
The Expert:
Terence Regan is a Field Applications Engineer at Amphenol Printed Circuits (APC). APC is a leader in high technology, high speed, high reliability products for the military and commercial markets. Terence has been in the Printed Circuit Board industry for over 35 years. His experience includes Military, Aerospace and High Reliability Commercial products. He has supported leading-edge designs from concept through fabrication and assembly, including rigid, rigid-flex and RF/microwave technologies. Through direct support with OEM engineers and designers, he has guided cost effective material selection, design requirements including impedance control and fabrication improvements, to ultimately produce high yielding products for customers. Terence holds a Bachelor of Science in Industrial Technology from San Jose State University.
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