World’s 1st 3.5D F2F Tech
Broadcom Inc. has launched the world's first 3.5D Face-to-Face (F2F) technology for AI XPUs. This new platform, called 3.5D eXtreme Dimension System in Package (XDSiP), integrates over 6000 mm² of silicon and up to 12 high bandwidth memory (HBM) stacks into a single package. This innovation aims to enhance efficiency and reduce power consumption for large-scale AI applications. #avgo #broadcom #amd #nvda #ai #
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