GLSUN Vertical Integration - From DFB Chips to BOSA
From DFB chips to XGS-PON BOSAs, vertical integration achieves outstanding performance. GLSUN controls core processes such as wafer fabrication and TO-CAN packaging to ensure product quality and performance, providing customers with cost-effective optical communication solutions and supporting the construction of next-generation networks.
As a patented, third-party ROHS tested, ISO 9001 and 14001 certified manufacturer with a factory area of 40,000+m², GLSUN focuses on Datacom, Telecom, RFoG, Medical Field and Petroleum Exploration, etc. With a wide product portfolio and strong production capabilities, our products include various optical switches (relays, MEMS, magnets, mini), free space isolators, VOA, splitters, WDM, CWDM, DWDM, micro circulators and optical line protection (OLP), optical bypass protection (OBP) equipment, customized Active & Passive equipment design, etc.
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