The reflowing the eMMC chip can help sometimes to retrieve data from a dead phone
The reflowing the eMMC chip can help sometimes to retrieve data from a dead phone
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BGA reflowing is a process used for repairing or re-soldering electronic components with BGA (Ball Grid Array) connections. This method allows for fixing soldering defects, such as poor contact between the component and the PCB (Printed Circuit Board). Here is the key information about this process:
What is BGA?
BGA is a packaging form for electronic components where the connections are in the form of small solder balls arranged in a grid on the underside of the component. These balls are made of solder alloy and serve as both electrical and mechanical contacts between the component and the PCB.
The Purpose of BGA Reflowing
Reflowing is intended to restore proper solder connections by addressing the following issues:
1. Cold solder joints – where the connection is not strong enough or poorly soldered.
2. Missing connections – when the solder balls are not properly bonded to the PCB.
3. Spread microcracks – which commonly occur due to temperature cycles or mechanical stress.
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