[👇HOW TO LEVEL THE SOLDER ON YOUR PADS👇] In electronics, maintaining circuit integrity is essential. Whether for repairs, upgrades, or modifications, mastering solder removal is a great skill for technicians. This guide provides a systematic approach to effectively removing excess solder from tracks, especially when replacing components. The following procedure describes the essential steps, required equipment, and materials needed to achieve optimal results.
PROCEDURE:
1. Choose a blade tip with a width that matches or slightly exceeds a row of tracks.
2. Start with a slightly cooler temperature (approximately 280ºC) and adjust as necessary.
3. Apply flux to the row of tracks.
4. Place the bevel of the tip slightly across the center of the row of tracks.
5. When the solder reflows across all the tracks, the surface will become uniform and shiny.
6. Lift the tip evenly from the tracks as quickly as possible
REQUIRED EQUIPMENT:
TESE Precision Hot Air Station
CDEB Soldering Station
MATERIALS:
Flux
C245 Blade Cartridge
⚠️NOTE: This technique can be used when components have been removed, but a significant amount of solder remains, which must be removed to replace the component. This almost always occurs when using hot air removal methods or solder wick.
🔗: https://www.jbctools.com
REF: IPC-7711/7721B SP
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