AMD FLIPS 3D CHIP STACK, RYZEN AI 300 LEAK, & More
Exciting news for AMD enthusiasts! In today’s video, we're diving into AMD’s latest move to reverse the 3D chip stack on their upcoming Ryzen 9000X3D CPUs—a change that’s delivering better performance and thermal efficiency. Join us as we explore what this 3D chip stack reversal actually means and how it's boosting clock speeds on the 9000X3D lineup. But that's not all—AMD's next-gen Ryzen AI 7 300 APU has surfaced in a leaked benchmark, revealing impressive specs built on the new Krackan Point architecture. We’ll break down everything you need to know, including its 8-core setup and RDNA 3.5 graphics capabilities. Also a leak has dropped revealing what AMD will unveil at CES 2025. Stay tuned, and don't forget to hit that subscribe button and turn on notifications for more in-depth PC tech news and updates. Drop a comment with your thoughts on these new AMD releases!
AMD Reversing 3D Stacking Hierarchy To Improve Clock Speeds & Thermal Efficiency of 9000X3D:
https://www.tomshardware.com/pc-compo...
Ryzen AI 7 300 APU Leaked Benchmark:
https://www.tomshardware.com/pc-compo...
What AMD Will Reveal At CES 2025:
https://overclock3d.net/news/cpu_main...
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